File:Desoldering with hot air.jpg
Size of this preview: 800 × 532 pixels. Other resolution: 2,200 × 1,464 pixels.
Original file (2,200 × 1,464 pixels, file size: 933 KB, MIME type: image/jpeg)
Summary
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A hot-air rework nozzle surrounding a large quad flat pack (QFP) on a circuit board, with a vacuum pick-up cup resting on the top of the package. Copied from Wikimedia Commons, where the photographer describes it as desoldering an IC with hot air.
Source
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Wikimedia Commons, File:Desoldering with hot air.jpg (retrieved 2026-10-25). Downscaled from 4064 x 2704 pixels.
Author
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Aisart (Wikimedia Commons user)
Licence
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CC BY-SA 3.0 (also GFDL), as stated on Wikimedia Commons.
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 14:45, 25 October 2026 | | 2,200 × 1,464 (933 KB) | Josh (talk | contribs) | Upload for repair technique pages |
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