File:NASA-STD-8739.2 Figure B-3, chip part solder fillet.png

Figure B-3, Chip Part Solder, from Appendix B of NASA-STD-8739.2: the minimum acceptable fillet on a chip component reaches 50 percent of the part thickness up the termination; the maximum acceptable fillet extends over the top of the metallised termination and keeps a positive wetting angle. Cropped from PDF page 69.

NASA, NASA-STD-8739.2 Workmanship Standard for Surface Mount Technology, 31 August 1999. NASA-hosted copy at https://s3vi.ndc.nasa.gov/ssri-kb/static/resources/NASA-STD-8739-2.pdf (retrieved 2026-10-25). The standard was cancelled on 17 October 2011.

NASA

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