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File:NASA-STD-8739.3 Figures 8-18 and 8-19, straight-through termination and lead retention.png

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Summary

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Line drawings from NASA-STD-8739.3, section 8.5.3: Figure 8-18, Straight-Through Termination, showing a lead through a non-plated hole (A) and a plated-through hole (B) protruding at least 0.5 mm (0.020 inch) and at most 2.29 mm (0.090 inch) beyond the pad, and Figure 8-19, Straight-Through Lead Retention, showing a lead bent 0 to 30 degrees from the axis of the hole to hold the part during soldering. Cropped from PDF page 48.

Source

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NASA, NASA-STD-8739.3 Soldered Electrical Connections, with Change 4 (approved 1997-12-15, Change 4 dated 2011). Copy downloaded from EverySpec, https://everyspec.com/NASA/NASA-NASA-STD/NASA-STD-8739x3_CHG-4_33216/ (retrieved 2026-10-25). The standard was cancelled on 17 October 2011, when NASA adopted IPC J-STD-001ES.

Author

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NASA

Licence

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Public domain. This is a work of the United States Government (NASA), not subject to copyright in the United States.

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current14:45, 25 October 2026Thumbnail for version as of 14:45, 25 October 20261,071 × 1,371 (324 KB)Josh (talk | contribs)Upload for repair technique pages

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