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File:NASA-STD-8739.3 cold and overheated solder connections.png

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Summary

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Photographs from Appendix A, Part II (Typical unacceptable solder connections) of NASA-STD-8739.3: Figure 5, a cold solder connection on a terminal, and Figure 6, an overheated solder connection on a round lead to a circular pad. Cropped from PDF page 84; the captions are on page 85.

Source

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NASA, NASA-STD-8739.3 Soldered Electrical Connections, with Change 4 (approved 1997-12-15, Change 4 dated 2011). Copy downloaded from EverySpec, https://everyspec.com/NASA/NASA-NASA-STD/NASA-STD-8739x3_CHG-4_33216/ (retrieved 2026-10-25). The standard was cancelled on 17 October 2011, when NASA adopted IPC J-STD-001ES.

Author

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NASA

Licence

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Public domain. This is a work of the United States Government (NASA), not subject to copyright in the United States.

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Date/TimeThumbnailDimensionsUserComment
current14:45, 25 October 2026Thumbnail for version as of 14:45, 25 October 20261,308 × 551 (390 KB)Josh (talk | contribs)Upload for repair technique pages

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